Automatic Sandblasting Machine for Ultra Thin Silicon Wafer with
1, Other name: shot peening abrator , Shot Blasting Machine, sand blasting machine,wheel blasting .
2, Certifications: ISO9001:2000 , CE
1. The device can separate micro powder above 800 meshes.
2. The device can achieve sandblasting for silicon wafer of below
1mm thickness and maintain 95% of breaking ratio.
Shot peening is a specialized blasting process that bombards a
metallic work piece with a round abrasive, typically steel shot, glass beads, or ceramic shot, thereby compressing the surface. This compression can greatly
improve the strength and fatigue life of the part. An analogy would
be the blacksmith that hammers a sword to increase its strength.
There are cyclone separation system and dust removal system ,
separator will separate the
abrasive from bust .and dust removal system can deal with and
collect the emit useless dust ,dust remove effect of good
.reduce the cost of abrasive and improve efficiency .and there is
no environmental pollution .